Mobile PCI Express connectors for QSEVEN and SMARC (smart mobility architecture) module applications.

High-density connector capable of supporting the latest technology infrastructure for the best graphics performance.
Being an industry standard, it allows for improved system graphics performance independently.

It also reduces the space occupied on the board due to its size and allows higher transmission speeds by supporting ultra-low-power modules.

Features

  • Pitch: 0.5 mm
  • Contacts: 314 for SMARC applications / 230 for QSEVEN applications
  • Height: 7.8mm
  • Current rating: 0.5 A per contact; 50 V AC DC
  • Insulation resistance 250 MOhm
  • No.cycles: 30
  • Insertion force 13N max
  • Pull-out force 16 N max
  • Supports 16 PCI Express signal lines
  • Up to 8 DDR2,DDR3,GDDR3,GDDR5
  • Up to 4 dual mode Display-ports 
  • Lvds,DVI,Hdmi

TEST REPORTS AVAILABLE

Main applications 

  • Personal Computer and notebook
  • Data center and servers
  • Workstations and advanced multimedia systems
  • Industrial automation and embedded systems

 

 

 
 

Con oltre 50 anni di presenza sul mercato, un punto di riferimento nel mercato dell'elettronica, dai connettori fino allo sviluppo di soluzioni custom tecnologicamente avanzate.

SUPPORTO CLIENTI

Per maggiori informazioni, contattaci inviando una richiesta qui

o chiamando il numero:

+39 02 34541160

CONTATTI

ORVEM SPA

Via Sacco e Vanzetti, 34 | 20099 Sesto San Giovanni | Milano | IT01751610153

email: vendite@orvem.com